IMPD

Conference Before 1999 3

2023-09-12

“Shallow Trench Isolation Characteristics with High-Density-Plasma (HDP) CVD Gap-Fill Oxide for Deep-Submicron CMOS Technologies”

Seungho Lee, Kuchul Jung, Jeonghwan Son, Sungwoong Chung, Minchul Chae, Junyong Kim, Wouns Yang, Youngiong Lee, Jeongmo Hwang

International Conference on Solid State Devices and Materials, IIanlamatsu,1997, pp.524-525

2023-09-12

“Optimization of repeater size to minimize interconnect line-induced delay time for high performance VLSI circuits”

Myoung-Jun Jang;Hi-Deok Lee;Myoung-Kyu Park;Hae-Wang Lee;Kyung-Jin Yoo;Sang-Bok Lee;Sung-Woong Chung;Dae-Gwan Kang;Jeong-Mo Hwang

ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361), 1999

2023-09-12

“Integration of Intermetal Dielectrics using Hydrogen Silsesquioxane Spin-On-Glass for sub-Quarter Micron 5 level interconnect Systems.”

Sung-Woong Chung, Jin Woong Kim, Dae-Won Suh, Nae-Hak Park, Jin-Won Park, Jae-Jeong Kim

Proc. Dielectrics for ULSI Multilevel interconnection conference (DUMIC) 1998, 151-154